thermal and flow simulation

here i came up with thermal simulation of microchip. in second part flow simulation of nozzle is explained. 
thermal simulation of microchip: Here I perform a steady state heat transfer in ordinary microchip. following data is used

• Material:- back side as copper and insulators are made from copper. Microchip material is Ceramic Porcelain

• Resistance between copper plate and Microchip is glue used in industries

• convection between 300K temperature environment and chip is taken into consideration

• heat power of chip is 0.2 W..............

 

Flow simulation of nozzle

here flow simulation in nozzle is performed. Water is used as fluid and standard convergent-divergent type nozzle. here I also use ball type simulation graphs............

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